A symmetric and interconnected skeleton structural (SISS) model for predicting thermal and electrical conductivity and Young's modulus of porous foams

Acta Materialia

Volumn 56, Issue 18, 2008, Pages 5138-5146

  Wang, J F ^a   Carson, J K ^b   Willix, J ^c   North, M F ^c   Cleland, D J ^a  

^a MASSEY UNIVERSITY   (New Zealand)

^b UNIVERSITY OF WAIKATO   (New Zealand)

^c RUAKURA RESEARCH CENTRE   (New Zealand)

Author keywords

Electrical conductivity; Foams; Mechanical properties; Modelling; Thermal conductivity

Indexed keywords

ALUMINUM; ALUMINUM CLADDING; CARBON; CELLS; CONTROL THEORY; CYTOLOGY; ELASTIC MODULI; ELASTICITY; ELECTRIC CONDUCTIVITY; FORECASTING; GRAPHITE; INTERCONNECTION NETWORKS; LIGHT METALS; NICKEL; STRUTS; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOELECTRICITY;

ALUMINIUM FOAMS; EFFECTIVE THERMAL CONDUCTIVITY; ELECTRICAL CONDUCTIVITY; FOAMS; GRAPHITE FOAMS; MECHANICAL PROPERTIES; MODELLING; NICKEL FOAMS; OPEN-CELL; OPEN-CELL FOAMS; PHYSICAL PROPERTIES; POROUS FOAMS; REASONABLE ACCURACY; UPPER AND LOWER BOUNDS; YOUNG'S MODULUS;

ELECTRIC CONDUCTIVITY OF SOLIDS;

EID: 53049097143     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2008.06.033     Document Type: Article

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