Synthesis of high purity O-cresol novolac epoxy resins

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Tian, Xiao Wei ^a   Yang, Zhen Guo ^a   Sun, Jiang Yan ^b   Ji, Zheng ^b  

^a FUDAN UNIVERSITY   (China)

^b Shanghai Sinyang Semiconductor Materials Co Ltd   (China)

Author keywords

High purity; Hydrolyzable halide; O cresol novolac epoxy resin; O cresol novolac resin

Indexed keywords

CATALYSIS; CHLORINE; CHLORINE COMPOUNDS; ELECTRONICS PACKAGING; EPOXY RESINS; FORMALDEHYDE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; PAINTING; TECHNOLOGY;

CO CATALYSTS; ELECTRONIC PACKAGING; ELECTRONIC SYSTEMS; EPICHLOROHYDRIN; EQUIVALENT WEIGHT; HIGH PURITY; HIGH-DENSITY PACKAGING; HYDROLYZABLE HALIDE; INTERNATIONAL CONFERENCES; MIXED CATALYST; NOVOLAC EPOXY; NOVOLAC RESINS; O-CRESOL; O-CRESOL NOVOLAC EPOXY RESIN; O-CRESOL NOVOLAC RESIN; OXALIC ACIDS; SOFTENING POINTS;

RESINS;

EID: 52649124814     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4607062     Document Type: Conference Paper

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