Preparation of high purity ECN resin used for encapsulation of integrated circuit

Hecheng Shuzhi Ji Suliao/China Synthetic Resin and Plastics

Volumn 13, Issue 1, 1996, Pages 19-22

  Shi, Zijin ^a   Pan, Zheng ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; ENCAPSULATION; INTEGRATED CIRCUIT MANUFACTURE; POLYMERIZATION; THERMAL EFFECTS;

O CRESOL NOVOLAC EPOXY RESIN;

EPOXY RESINS;

EID: 0030105947     PISSN: 10021396     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)