Reliability study of flexible display module by experiments

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Chen, Quayle ^a   Xu, Leon ^a   Salo, Antti ^a   Neto, Gustavo ^b   Freitas, Germano ^b  

^a NOKIA RESEARCH CENTER   (United States)

^b Nokia Technology Institute (INdT)   (Brazil)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EXPERIMENTS; FAILURE ANALYSIS; FATIGUE TESTING; QUALITY ASSURANCE; RELIABILITY ANALYSIS; SAFETY FACTOR; TECHNOLOGY; TESTING;

ELECTRONIC PACKAGING; FATIGUE TESTS; FLEXIBLE DISPLAYS; HIGH-DENSITY PACKAGING; INTERNATIONAL CONFERENCES; MECHANICAL BEHAVIORS; TEST SET UPS; USE CASES;

RELIABILITY;

EID: 52449094168     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4607161     Document Type: Conference Paper

References (10)

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