New manufacturing method for capacitive ultrasonic transducers with monocrystalline membrane

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2007, Pages 581-584

  Rey, Patrice ^a   Salhi, M ^a   Giroud, S ^a   Robert, P ^a   Lagahe Blanchard, C ^b   Clatot, S ^c   Ballandras, S ^c  

^a CEA LETI   (France)

^b TRACIT Technologies   (France)

^c FEMTO ST INSTITUTE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMECHANICAL COUPLING; ELECTROMECHANICAL DEVICES; MEMS; MONOCRYSTALLINE SILICON; SILICON WAFERS; TRANSDUCERS; ULTRASONIC TRANSDUCERS;

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER; CAPACITIVE ULTRASONIC TRANSDUCER; ELECTROMECHANICAL COUPLING COEFFICIENTS; IMPEDANCE MEASUREMENT; MANUFACTURING METHODS; MONOCRYSTALLINE; POLYSILICON ELECTRODES; SACRIFICIAL LAYER;

WAFER BONDING;

EID: 52249086063     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/memsys.2007.4432987     Document Type: Conference Paper

References (4)

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2. Oliver Ahrens; IEEE Tr. Ultrason. Ferroel. Fr Control, 49 No9, Sept 2002, pp1321-1329
3. Arif Sanli Ergun, Yongly Huang, Xuefeng Zhuang, IEEE Tr. Ultrason. Ferroel. Fr Control, 52 No12, Dec 2005, pp2242-22
4. Marta Buigas, Ultrason. 43, 2005, pp383-390