Significance of conductivity and thickness of thin inkjet printed microstrip lines

12th IEEE Workshop on Signal Propagation on Interconnects, SPI

Volumn , Issue , 2008, Pages

  Pynttäri, Vesa ^a   Mäkinen, Riku ^a   Lilja, Juha ^a   Pekkanen, Ville ^a   Mansikkamäki, Pauliina ^a   Kivikoski, Markku ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; INTERCHANGES; MICROSTRIP DEVICES; MICROSTRIP LINES;

CONDUCTOR LOSSES; INK-JET PRINTS; LAYER THICKNESSES; MICRO STRIPS; MICROSTRIP RESONATORS; PARAMETER VARIATIONS; PRINTABLE ELECTRONICS; SIGNAL PROPAGATION; SILVER NANO PARTICLES; SIMULATIONS AND MEASUREMENTS; TEST STRUCTURES;

SILVER;

EID: 51849167872     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SPI.2008.4558410     Document Type: Conference Paper

References (6)

1. th EMPC, Oulu, Finland, June 17-20, 2007, pp. 718-722
2. th EPEP, Atlanta, GA, Oct. 29-31, 2007, pp. 219-222.
3. th EMPC, Oulu, Finland, June 17-20, 2007, pp. 235-240.
4. Ouyang, Y and Chappel, W, "Measurement of electrotextiles for high frequency applications," IEEE MTT-S Dig., Long Beach, CA, June 12-17, 2005, pp. 1679-1682.
5. Carroll, J, Li, M and Chang, K, "New technique to measure transmission line attenuation," IEEE T. Microwave Theory Tech., vol. 43, No 1 (1995), pp. 219-222.
6. Computer Simulation Technology, http://www.cst.de