High-frequency characterization and simulation of conductor loss in printable electronics technology

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2007, Pages 219-222

  Pynttäri, Vesa ^a   Mäkinen, Riku ^a   Lilja, Juha ^a   Pekkanen, Ville ^a   Mäntysalo, Matti ^a   Mansikkamäki, Pauliina ^a   Kivikoski, Markku ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC LOSSES; ELECTRONICS PACKAGING; MICROSTRIP DEVICES;

CONDUCTOR LOSSES; HIGH FREQUENCIES; MICROSTRIP RESONATORS; PRINTABLE ELECTRONICS; SILVER NANOPARTICLES; SIMULATIONS AND MEASUREMENTS; TEST STRUCTURES;

SILVER;

EID: 47949094223     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2007.4387165     Document Type: Conference Paper

References (5)

1. th EMPC, June 17-20, 2007, Oulu, Finland, pp. 718-722.
2. th EMPC, June 17-20, 2007, Oulu, Finland, pp. 235-240.
3. Y. Ouyang and W. Chappel, "Measurement of electrotextiles for high frequency applications," IEEE MTT-S Dig., June 12-17, 2005, Long Beach, CA, pp. 1679-1682.
4. J. Carroll, M. Li and K. Chang, "New technique to measure transmission line attenuation," IEEE T. Microwave Theory Tech., vol. 43, pp. 219-222, Jan 1995.
5. Computer Simulation Technology, http://www.cst.de