Novel ultra-high dielectric constant polymer based composite for embedded capacitor application

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC 2002 - Conference Proceedings

Volumn , Issue , 2002, Pages 196-200

  Rao, Yang ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CAPACITORS; DIELECTRIC LOSSES; ELECTRONICS PACKAGING; HIGH-K DIELECTRIC; MICROELECTRONICS; PHOTONICS; PRINTED CIRCUIT BOARDS; SOLVENTS;

ELECTRICAL PERFORMANCE; ELECTRONIC ASSEMBLIES; ELECTRONIC PACKAGING; HIGH DIELECTRIC CONSTANTS; PERCOLATION THRESHOLDS; POLYMER BASED COMPOSITE; PROCESS COMPATIBILITY; ULTRA-HIGH DIELECTRIC CONSTANT;

FILLED POLYMERS;

EID: 51849137807     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2002.1020210     Document Type: Conference Paper

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