High-temperature oxidation behavior of Sn-8Zn-3Bi-P and its effect on properties

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 29, Issue 8, 2008, Pages

  Fang, Yili ^a   Zhou, Jian ^a   Xue, Feng ^a   Sun, Yangshan ^a  

^a SOUTHEAST UNIVERSITY   (China)

Author keywords

Lead free solder; Mechanism; Oxidation resistance; P; Sn 8Zn 3Bi

Indexed keywords

BRAZING; CHEMICAL OXYGEN DEMAND; LEAD; OXIDATION; OXIDE FILMS; SOLDERING ALLOYS; WELDING; ZINC;

LEAD-FREE SOLDER; MECHANISM; OXIDATION RESISTANCE; P; SN-8ZN-3BI;

TIN;

EID: 51649109699     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

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3. Huang Chiawei, Lin Kwanglung. Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates[J]. Journal of Electronic Materials, 2006, 35(12): 2135-2141.
4. Sungil Cho, Jin Yu, Sung K. et al. The oxidation of lead-free Sn alloys by electrochemical reduction analysis[J]. Journal of the Minerals Metals and Materials Society, 2005(6): 50-52.
5. Xian Aiping, Gong Guoliang. Oxidation behavior of molten tin doped with phosphorus[J]. Journal of Electronic Materials, 2007, 36(12): 1669-1678.