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Volumn , Issue , 2005, Pages

Thermal analysis of medium voltage fuses using the finite element method

Author keywords

Cosmos software; Finite element method; Medium voltage fuse; Thermal analysis

Indexed keywords

COMPUTER AIDED SOFTWARE ENGINEERING; THERMOANALYSIS;

EID: 51549099207     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PTC.2005.4524671     Document Type: Conference Paper
Times cited : (7)

References (11)
  • 1
    • 0029307652 scopus 로고
    • Simulation of the heat-transfer phenomena in electrical fuses by means of the digital computer
    • M Sasu, "Simulation of the heat-transfer phenomena in electrical fuses by means of the digital computer", European Transactions on Electrical Power Engineering, Vol. 5, No. 3, pp. 187-191, 1995.
    • (1995) European Transactions on Electrical Power Engineering , vol.5 , Issue.3 , pp. 187-191
    • Sasu, M.1
  • 3
    • 51549117067 scopus 로고    scopus 로고
    • A Baraboi, I Ciutea, M Adam, C Pancu, TA Baraboi, Modelling and simulation of the thermal stress at the electric fuses contacts, 6th International Conference on Electrical Fuses and their Applications, Turin 1999, pp. 59-64.
    • A Baraboi, I Ciutea, M Adam, C Pancu, TA Baraboi, "Modelling and simulation of the thermal stress at the electric fuses contacts", 6th International Conference on Electrical Fuses and their Applications, Turin 1999, pp. 59-64.
  • 5
    • 51549099183 scopus 로고    scopus 로고
    • JGJ Sloot, Analog simulations of the heat flow in a high voltage fuse, 3rd International Conference on Electrical Fuses and their Applications, Eindhoven 1987, pp. 7-11.
    • JGJ Sloot, Analog simulations of the heat flow in a high voltage fuse, 3rd International Conference on Electrical Fuses and their Applications, Eindhoven 1987, pp. 7-11.
  • 6
    • 51549097525 scopus 로고    scopus 로고
    • G Hoffmann, U Kaltenborn, Thermal modeling of high voltage H.R.C. fuses and simulation of tripping characteristic, 7th International Conference on Electrical Fuses and their Applications, Gdansk 2003, pp. 174-180.
    • G Hoffmann, U Kaltenborn, Thermal modeling of high voltage H.R.C. fuses and simulation of tripping characteristic, 7th International Conference on Electrical Fuses and their Applications, Gdansk 2003, pp. 174-180.
  • 7
    • 51549118045 scopus 로고    scopus 로고
    • L Fernández, C Cañas, J Llobell, J Curiel, J Aspas, F Ruz, F Caballé, A model for pre-arcing behaviour simulation of HV full-range fuse-links using the finite element method, 5th International Conference on Electrical Fuses and their Applications, Ilmenau 1995, pp. 162-168.
    • L Fernández, C Cañas, J Llobell, J Curiel, J Aspas, F Ruz, F Caballé, "A model for pre-arcing behaviour simulation of HV full-range fuse-links using the finite element method", 5th International Conference on Electrical Fuses and their Applications, Ilmenau 1995, pp. 162-168.
  • 10
    • 51549097933 scopus 로고    scopus 로고
    • V Giurgiu, GH Oarga, S Purdel, Analysis of thermal phenomena in high-voltage fuse-links, 6th International Conference on Electrical Fuses and their Applications, Turín 1999, pp. 65-68.
    • V Giurgiu, GH Oarga, S Purdel, Analysis of thermal phenomena in high-voltage fuse-links, 6th International Conference on Electrical Fuses and their Applications, Turín 1999, pp. 65-68.
  • 11
    • 0034219574 scopus 로고    scopus 로고
    • Heat analysis of a fuse for semiconductor devices protection using 3-D finite element method
    • Julio
    • Y Kawase, T Miyatake, S Ito, Heat analysis of a fuse for semiconductor devices protection using 3-D finite element method, IEEE Transactions on Magnetics, Vol. 36, No. 4, pp. 1377-1380, Julio 2000.
    • (2000) IEEE Transactions on Magnetics , vol.36 , Issue.4 , pp. 1377-1380
    • Kawase, Y.1    Miyatake, T.2    Ito, S.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.