Dielectric breakdown strength of silicone gel under various environmental conditions

2005 IEEE Russia Power Tech, PowerTech

Volumn , Issue , 2005, Pages

  Finis, G ^a   Claudi, A ^b,c,d,e   Malin, G ^f,g,h,i  

^a UNIVERSITY OF KASSEL   (Germany)

^b AEG   (Canada)

^c HAEFELY   (Switzerland)

^d RAYCHEM   (Germany)

^e CIGRE Working Group D13306: Monitoring and Diagnostic Systems

^f GRAZ UNIVERSITY OF TECHNOLOGY   (Austria)

^g Kabel und Drahtwerke AG   (Austria)

^h Raychem GmbH   (Austria)

ⁱ Tyco Electronics Raychem GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC BREAKDOWN STRENGTH; INSULATION MATERIALS;

CHEMICAL PROPERTIES; COLLOIDS; GELATION; GELS; INSULATING MATERIALS; INSULATION; MECHANICAL PROPERTIES; RUBBER; STRESSES;

SILICONES;

EID: 51549093984     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PTC.2005.4524423     Document Type: Conference Paper

References (7)

1. Hechtel, W.: Chemistry and Technology of Room-Temperature-Vulcanizable Silicone Rubber. Silicones Chemistry and Technology, Vulkan-Verlag, Essen, 1991
2. Yaworski, H. G.; Bukovnik, R.: Silicone gel technology for power cable accessories. IEEE Transmission and Distribution conference, Atlanta Nov. 2001, 1TD051
3. Ruemenapp, T.; Ebke, T.; Peier, D.: Investgation of the Aging Performance of Silicone Gel used in High-Power-Semiconductors. 12th International Symposium On High Voltage Engineering (ISH 2001), Bangalore (India), 2001
4. Ebke, T.; Khaddour, A.; Peier, D.: Degradation of Silicone Gel by Partial Discharge due to Different Defects. Eight International Conference Dielectric Materials, Measurement and Applications, Edinburgh, 2000
5. Craig, G.; Roberts. D.; Yaworski, H. G.: The Use of Silicone Gels for Jointing Power Cables. IEEE Transmission and Distribution conference, Los Angeles, Sept. 1996, 0-7803-3522-8/96
6. Finis, G.; Claudi, A.: Silicone Gel as an Insulation Material for MV-Insulation Applications. 14th International Symposium on High Voltage Engineering, Beijing, China, August 2005
7. Joint Task Force 21/15: Interfaces in accessories for extruded HV an EHV cables, Electra Nr. 203, August 2003