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Volumn , Issue , 2006, Pages
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Industry drop tests in solder joint reliability study of molded flip chip package
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Author keywords
[No Author keywords available]
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Indexed keywords
BRAZING;
BRITTLE FRACTURE;
CHIP SCALE PACKAGES;
COMPUTER NETWORKS;
CRACKS;
DESIGN;
DROPS;
DYNAMIC ANALYSIS;
ELECTRONIC EQUIPMENT MANUFACTURE;
ELECTRONICS PACKAGING;
FAILURE ANALYSIS;
FINITE ELEMENT METHOD;
FLIP CHIP DEVICES;
FLUID MECHANICS;
FRACTURE;
MACHINE DESIGN;
PACKAGING MATERIALS;
RELIABILITY;
SAFETY FACTOR;
SENSITIVITY ANALYSIS;
STRAIN GAGES;
STRAIN MEASUREMENT;
TESTING;
THEOREM PROVING;
TRACE ANALYSIS;
TRACE ELEMENTS;
WELDING;
DROP TESTING;
QUALITY ASSURANCE;
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EID: 51449109576
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/EMAP.2006.4430610 Document Type: Conference Paper |
Times cited : (3)
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References (6)
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