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Volumn , Issue , 2006, Pages

Industry drop tests in solder joint reliability study of molded flip chip package

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; BRITTLE FRACTURE; CHIP SCALE PACKAGES; COMPUTER NETWORKS; CRACKS; DESIGN; DROPS; DYNAMIC ANALYSIS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FLUID MECHANICS; FRACTURE; MACHINE DESIGN; PACKAGING MATERIALS; RELIABILITY; SAFETY FACTOR; SENSITIVITY ANALYSIS; STRAIN GAGES; STRAIN MEASUREMENT; TESTING; THEOREM PROVING; TRACE ANALYSIS; TRACE ELEMENTS; WELDING;

EID: 51449109576     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2006.4430610     Document Type: Conference Paper
Times cited : (3)

References (6)
  • 1
    • 32844460289 scopus 로고    scopus 로고
    • Solder Joint Reliability Prediction of Flip Chip Packages under Shock Loading Environment
    • Loh, Wei Keat and Garner, Luke, "Solder Joint Reliability Prediction of Flip Chip Packages under Shock Loading Environment," Proceedings ofASME InterPack 2005.
    • (2005) Proceedings ofASME InterPack
    • Loh, W.K.1    Garner, L.2
  • 2
    • 32844466143 scopus 로고    scopus 로고
    • Mechanical Shock Fe Modeling For ATCA Circuit Board Design
    • San Francisco, California
    • Liang, Frank Z, Palanuk, Larry and Hezeltine, Wade, "Mechanical Shock Fe Modeling For ATCA Circuit Board Design," Proceedings of ASME InterPack 2005, San Francisco, California.
    • (2005) Proceedings of ASME InterPack
    • Liang, F.Z.1    Palanuk, L.2    Hezeltine, W.3
  • 3
    • 23244439533 scopus 로고    scopus 로고
    • Mechanical Analysis Challenges in Micro-Electronic Packaging
    • Boston, MA, May 25-27
    • Garner, Luke and Liang, Frank, "Mechanical Analysis Challenges in Micro-Electronic Packaging," ABAQUS Users' Conference Proceedings, pp. 21-37, Boston, MA, May 25-27, 2004.
    • (2004) ABAQUS Users' Conference Proceedings , pp. 21-37
    • Garner, L.1    Liang, F.2
  • 6
    • 51449110341 scopus 로고    scopus 로고
    • Board Deflection/ Strain instead of Acceleration Measurements for Circuit Board FE Shock Model Validation
    • Liang, Frank Z, William, Richard L. and Hezeltine, Wade, "Board Deflection/ Strain instead of Acceleration Measurements for Circuit Board FE Shock Model Validation," Proceedings of IMECE 2005.
    • (2005) Proceedings of IMECE
    • Liang, F.Z.1    William, R.L.2    Hezeltine, W.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.