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Volumn , Issue , 2006, Pages

Unique White LED packaging systems

Author keywords

Heat resistance and UV resistance; VPES; White LED

Indexed keywords

ABS RESINS; COMPUTER NETWORKS; CONSERVATION; ELECTROMAGNETIC WAVES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FLUORESCENT LAMPS; LIGHTING; RESINS;

EID: 51449107143     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2006.4430626     Document Type: Conference Paper
Times cited : (3)

References (12)
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    • I.Akasaki, "The fascination of Blue LED device" May1997.
  • 3
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    • Application of high-brightness InGaN LED for large size full color display
    • K. Bando "Application of high-brightness InGaN LED for large size full color display", IDW'99
    • IDW'99
    • Bando, K.1
  • 4
    • 84899666848 scopus 로고    scopus 로고
    • K.Bando, et al. Development of high-bright and pure- whiteLEDlamps, J.Light&Vis.Environ.22, No1 (1998) pp.2-5.
    • K.Bando, et al. "Development of high-bright and pure- whiteLEDlamps", J.Light&Vis.Environ.Vol.22, No1 (1998) pp.2-5.
  • 5
    • 51449092196 scopus 로고    scopus 로고
    • S.Nakamura, et al. Japan Patent (JP) P3366586
    • S.Nakamura, et al. Japan Patent (JP) P3366586
  • 6
    • 0031640738 scopus 로고    scopus 로고
    • High reliability, High Density, Low Cost Packaging Systems for Matrix BGA &CSP Using VPES (Vacuum Printing Encapsulation Systems)
    • May
    • A.Okuno.: High reliability, High Density, Low Cost Packaging Systems for Matrix BGA &CSP Using VPES (Vacuum Printing Encapsulation Systems), 48th Electronic Components & Technology Conference, p109 (May, 1998)
    • (1998) 48th Electronic Components & Technology Conference , pp. 109
    • Okuno, A.1
  • 8
    • 51449099916 scopus 로고    scopus 로고
    • A.Okuno, et al. The liquid epoxy resin by Printing Encapsulation Systems (PES) for LSI and the reliability of them The transaction of the institute of electronics, information and communication engineers pp431-439, Sep1996.
    • A.Okuno, et al. "The liquid epoxy resin by Printing Encapsulation Systems (PES) for LSI and the reliability of them" The transaction of the institute of electronics, information and communication engineers pp431-439, Sep1996.
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    • Feb
    • F.Tamamushi, et al. "Rikagaku Dictionary" 〈Iwanami〉 p.349-350. Feb. 1985
    • (1985) 〈Iwanami〉 , pp. 349-350
    • Tamamushi, F.1
  • 11
    • 0038074762 scopus 로고    scopus 로고
    • Unique LED dot matrix module by VPES™ (Vacuum Printing Encapsulation Systems) and high reliability transparent liquid type epoxy resin
    • April
    • th Electronic Components & Technology Conference, p206-211 (April, 2000)
    • (2000) th Electronic Components & Technology Conference , pp. 206-211
    • Okuno, A.1
  • 12
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.