Void formation in nanocrystalline Cu film during uniaxial relaxation test

Acta Materialia

Volumn 56, Issue 17, 2008, Pages 4921-4931

  Inoue, Junya ^a   Fujii, Yosuke ^a   Koseki, Toshihiko ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

Cavitation; Ductility; Nanocrystalline Cu; Thin film

Indexed keywords

NANOCRYSTALLINE ALLOYS; NANOSTRUCTURED MATERIALS; POLYIMIDES; POLYMERS; THICK FILMS; THIN FILMS;

CAVITATION; DUCTILITY; NANOCRYSTALLINE CU; THIN FILM;

COPPER;

EID: 51449101013     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2008.06.008     Document Type: Article

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