Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1614-1619

  Agwai, Abigail ^a   Guven, Ibrahim ^a   Madenci, Erdogan ^a  

^a University of Arizona   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC COMPONENTS; ELECTRONIC PACKAGING; PERIDYNAMIC THEORY;

FORECASTING;

THIN FILM DEVICES;

EID: 51349146671     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550192     Document Type: Conference Paper

References (7)

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2. Silling, S. A., "Reformulation of Elasticity Theory for Discontinuities and Long-Range Forces," Journal of Mechanics and Physics of Solids, Vol. 48, 2000, pp. 175-209.
3. Sanchez, J. M., et al., "Cross-Sectional Nanoindentation: A New Technique for Thin Film Interfacial Adhesion Characterization," Acta Materialia, Vol. 47, 1999, pp. 4405-4413.
4. Scherban, T., et al., "Characterization of Interconnect Interfacial Adhesion by Cross-Sectional Nanoindentation," International Journal of Fracture, Vol. 119, 2003, pp. 421-429.
5. Silling, S. A., and Askari, E., "A Meshfree Method Based on the Peridynamic Model of Solid Mechanics," Computers and Structures, Vol. 83, 2005, pp. 1526-1535.
6. Field, J. E., "Brittle Fracture: its Study and Application," Contemporary Physics, Vol. 12, 1971, pp. 1-31.
7. http://www.memsnet.org/material/