메뉴 건너뛰기




Volumn , Issue , 2008, Pages 205-207

Highly-reliable low-resistance Cu interconnects with PVD-Ru/Ti barrier metal toward automotive LSIs

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; CRYSTAL GROWTH; GRAIN BOUNDARIES; LSI CIRCUITS; METALS; OPTICAL INTERCONNECTS; RELIABILITY;

EID: 51149088939     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546968     Document Type: Conference Paper
Times cited : (16)

References (6)
  • 1
    • 29244444803 scopus 로고    scopus 로고
    • S. Im, et al, et al., IEEE Trans. Electron Devices, 52, 12, p.2710, 2005.
    • S. Im, et al, et al., IEEE Trans. Electron Devices, 52, 12, p.2710, 2005.
  • 2
    • 34748818726 scopus 로고    scopus 로고
    • R.Sarvari, et al., IITC 2005, p.197.
    • (2005) IITC , pp. 197
    • Sarvari, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.