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Volumn , Issue , 2008, Pages 205-207
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Highly-reliable low-resistance Cu interconnects with PVD-Ru/Ti barrier metal toward automotive LSIs
a
NEC CORPORATION
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER NETWORKS;
CRYSTAL GROWTH;
GRAIN BOUNDARIES;
LSI CIRCUITS;
METALS;
OPTICAL INTERCONNECTS;
RELIABILITY;
BARRIER METALS;
INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE;
COPPER;
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EID: 51149088939
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IITC.2008.4546968 Document Type: Conference Paper |
Times cited : (16)
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References (6)
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