Removal of copper and zinc from aqueous solutions and industrial effluents using emulsion liquid membrane technique

Asia-Pacific Journal of Chemical Engineering

Volumn 3, Issue 4, 2008, Pages 387-399

  Venkatesan, S ^a   Begum, K M Meera Sheriffa ^a  

^a NATIONAL INSTITUTE OF TECHNOLOGY   (India)

Author keywords

Copper; D2EHPA; Electroplating effluent; Emulsion liquid membrane; Zinc

Indexed keywords

BIOACTIVITY; CHEMICAL OXYGEN DEMAND; CIVIL AVIATION; CONCENTRATION (PROCESS); COPPER; EFFLUENTS; ELECTROLYSIS; ELECTROPLATING SOLUTIONS; EMULSIFICATION; INDUSTRIAL WATER TREATMENT; LIQUID MEMBRANES; MEMBRANES; METAL IONS; OPTIMIZATION; PETROLEUM PRODUCTS; PHASE STABILITY; SEWAGE; SOLUTIONS; SPEED; STRIPPING (DYES); SURFACE ACTIVE AGENTS; ZINC;

D2EHPA; ELECTROPLATING EFFLUENT; EMULSION LIQUID MEMBRANE; EXTERNAL PHASE;

CHEMICALS REMOVAL (WATER TREATMENT);

EID: 51049101497     PISSN: 19322135     EISSN: 19322143     Source Type: Journal    
DOI: 10.1002/apj.160     Document Type: Article

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