Materials and processes for high signal propagation performance and reliable 32 nm node BEOL

Proceedings of the IEEE 2007 International Interconnect Technology Conference - Digest of Technical Papers

Volumn , Issue , 2007, Pages 1-3

  Arnal, V ^a   Farcy, A ^a   Aimadeddine, M ^a   Jousseaume, V ^b   Gosset, L G ^c   Guillan, J ^a   Assous, M ^b   Favennec, L ^a   Zenasni, A ^b   David, T ^b   Hamioud, K ^c   Chapelon, L L ^a   Jourdan, N ^a   Vanypre, T ^c   Mourier, T ^b   Chausse, P ^b   Maitrejean, S ^b   Guedj, C ^b   Torres, J ^a  

^a STMICROELECTRONICS   (France)

^b CEA LETI   (France)

^c NXP SEMICONDUCTORS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POWER UTILIZATION; INTEGRATED CIRCUITS; METALLIZING; OPTICAL INTERCONNECTS; OPTIMIZATION;

BEOL; DELAY TIME; HIGH SIGNAL PROPAGATION PERFORMANCE; NANOMETRIC DIMENSIONS;

SIGNAL PROCESSING;

EID: 34748870920     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iitc.2007.382330     Document Type: Conference Paper

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