300 mm multi level air gap integration for edge interconnect technologies and specific high performance applications

2008 IEEE International Interconnect Technology Conference, IITC

Volumn , Issue , 2008, Pages 196-198

  Gras, R ^a,c   Gaillard, F ^b   Bouchu, D ^b   Farcy, A ^a   Petitprez, E ^a   Icard, B ^b   Le Denmat, J C ^a   Pain, L ^b   Bustos, J ^a   Haumesser, P H ^b   Brun, P ^b   Imbert, G ^a   Clement L ^a   Borowiak, C ^a   Rivoire, M ^a   Euvrard, C ^b   Arnal, V ^a   Olivier, S ^b   Moreau, S ^b   Mellier, M ^a   Chevolleau, T ^c   Passemard, G ^a   Torres, J ^a   more..

^a STMICROELECTRONICS   (France)

^b CEA LETI   (France)

^c CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; GALLIUM ALLOYS;

AIR GAP INTEGRATION; AIR GAPS; MULTI-LEVEL;

TECHNOLOGY;

EID: 50949097598     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546965     Document Type: Conference Paper

References (11)

1. L.C. Bassman et al., MRS Symp. Proc. 473, p. 323-328 (1997)
2. V. Arnal et al., Proceedings of IITC 2001, p. 298-300
3. S. Nitta et al., AMC 2007, in press
4. R. Daamen et al. Proceedings of IITC 2005, p. 240-242
5. L.G. Gosset et al., Proceedings of IITC 2003, p. 65-67
6. F. Gaillard et al., Microelectronic Engineering 83, p. 2309-2313 (2006)
7. L.G. Gosset et al., Proceedings of IITC 2007, p. 58-60
8. R. Fox et al., Proceedings of IEDM 2005, p. 87-90
9. Y. Kagawa et al., Proceedings of IITC 2006, p.207-209 (2006)
10. M. Aimadeddine et al., Proceedings of IITC 2007, p.175-177
11. F. Gaillard, Proceedings of VMIC 2007, p. 299-304