Simulation of the effect of dielectric air gaps on interconnect reliability

Materials Research Society Symposium - Proceedings

Volumn 473, Issue , 1997, Pages 323-328

  Bassman, L C ^a   Vinci, R P ^a   Shieh, B P ^a   Kim, D K ^a   McVittie, J P ^a   Saraswat, K C ^a   Deal, M D ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CAPACITANCE; COMPUTER SIMULATION; CRACK PROPAGATION; ELECTROMIGRATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PASSIVATION; PERMITTIVITY; STRESSES;

DIELECTRIC AIR GAPS;

DIELECTRIC MATERIALS;

EID: 0031384416     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-473-323     Document Type: Conference Paper

References (7)