Experiments on a novel vapor chamber

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 75-78

  Wong, Shwin Chung ^a   Wu, Jia Da ^a   Han, Wei Lun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL FLOW; COPPER; CURING; ELECTRONICS ENGINEERING; FIGHTER AIRCRAFT; FORMING; HEAT SINKS; PLATES (STRUCTURAL COMPONENTS); THERMAL LOAD; THERMOMECHANICAL TREATMENT; VAPORS; WALLS (STRUCTURAL PARTITIONS); WATER VAPOR;

HEAT LOADS; VAPOR CHAMBERS;

HEAT RESISTANCE;

EID: 50949087018     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544256     Document Type: Conference Paper

References (8)

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