A cracked functionally graded piezoelectric material strip under transient thermal loading

Acta Mechanica

Volumn 199, Issue 1-4, 2008, Pages 53-70

  Ueda, S ^a  

^a OSAKA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; BOUNDARY VALUE PROBLEMS; CRACKS; DIFFERENTIAL EQUATIONS; FOURIER TRANSFORMS; IMAGE SEGMENTATION; INITIAL VALUE PROBLEMS; INTEGRAL EQUATIONS; LAPLACE TRANSFORMS; MATHEMATICAL TRANSFORMATIONS; MEMS; PIEZOELECTRIC DEVICES; PIEZOELECTRIC MATERIALS; PIEZOELECTRICITY; STRENGTH OF MATERIALS; STRESS CONCENTRATION; SURFACES; THERMAL STRESS; THERMOELASTICITY;

CONTACT PROBLEMS; CRACK FACES; CRACK SURFACE TRACTION; EDGE CRACKS; FOURIER; FUNCTIONALLY GRADED PIEZOELECTRIC MATERIAL; GEOMETRIC PARAMETERS; INITIAL TEMPERATURE; LAPLACE-TRANSFORM; MATE RIAL PROPERTIES; MIXED BOUNDARY-VALUE PROBLEMS; NON-HOMOGENEOUS; NUMERICA L RESULTS; SINGULAR INTEGRAL EQUATION; STATIC MECHANICAL LOADING; STRESS DISTRIBUTIONS; STRESS INTENSITY FACTORS; TOP SURFACE; TRANSIENT TEMPERATURES; TRANSIENT THERMAL LOADING;

STRESSES;

EID: 50649115545     PISSN: 00015970     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00707-007-0561-6     Document Type: Article

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