A cracked piezoelectric material strip under transient thermal loading

Journal of Applied Mechanics, Transactions ASME

Volumn 69, Issue 4, 2002, Pages 539-546

  Wang, B L ^a   Mai, Y W ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COOLING; CRACKS; HEATING; INTEGRAL EQUATIONS; PROBLEM SOLVING; STRESS CONCENTRATION; STRESS INTENSITY FACTORS; SURFACE PROPERTIES; THERMAL INSULATION; THERMAL LOAD; THERMAL STRESS;

CRACK SURFACE TRACTIONS;

PIEZOELECTRIC MATERIALS;

EID: 0036660708     PISSN: 00218936     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1429935     Document Type: Article

References (15)

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