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Volumn 202, Issue 22-23, 2008, Pages 5508-5511
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Effect of bilayer period on CrN/Cu nanoscale multilayer thin films
a
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Author keywords
Bilayer period; CrN Cu; Nanoscale multilayer
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Indexed keywords
ATOMIC FORCE MICROSCOPY;
CLADDING (COATING);
COPPER;
FIELD EMISSION;
FILM PREPARATION;
HIGH RESOLUTION ELECTRON MICROSCOPY;
HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY;
IMAGING TECHNIQUES;
INORGANIC COATINGS;
LAMINATING;
MAGNETRON SPUTTERING;
MECHANICAL PROPERTIES;
METALS;
MICROSCOPIC EXAMINATION;
MOLECULAR BEAM EPITAXY;
MULTILAYER FILMS;
NANOSTRUCTURED MATERIALS;
NANOTECHNOLOGY;
NITRIDES;
SCANNING PROBE MICROSCOPY;
THICK FILMS;
THIN FILMS;
TRANSITION METALS;
WEAR RESISTANCE;
BALL ON DISC TESTING;
BILAYER PERIOD;
BILAYER THICKNESS;
CLOSED FIELD UNBALANCED MAGNETRON SPUTTERING;
CRN/CU;
FIELD-EMISSION TRANSMISSION ELECTRON MICROSCOPY;
HIGH HARDNESS;
HIGH RESISTANCE;
HIGH WEAR RESISTANCE;
HIGH-RESOLUTION X-RAY DIFFRACTION;
LAMINATED LAYERS;
MULTI LAYERING;
MULTI-LAYER STRUCTURES;
NANO-INDENTATION;
NANOSCALE MULTILAYER;
PREFERRED ORIENTATION;
ROTATIONAL SPEEDS;
STRUCTURAL CHARACTERIZATIONS;
SUPERHARD;
MULTILAYERS;
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EID: 50349101951
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/j.surfcoat.2008.06.028 Document Type: Article |
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Times cited : (29)
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References (14)
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