Cost-effective and high performance Cu interconnects (keff=2.75) with continuous SiOCH stack incorporating a low-k barrier cap (k=3.1)

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 2007, Pages 973-976

  Ueki, M ^a   Yamamoto, H ^a   Ito, F ^a   Kawahara, J ^a   Tada, M ^a   Takeuchi, T ^a   Saito, S ^a   Furutake, N ^a   Onodera, T ^a   Hayashi, Y ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COST EFFECTIVENESS; ELECTRON DEVICES; HIGH PERFORMANCE LIQUID CHROMATOGRAPHY; OPTICAL INTERCONNECTS;

CU INTERCONNECTS;

COPPER ALLOYS;

EID: 50249084986     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.2007.4419116     Document Type: Conference Paper

References (5)

1. M. Tagami et al., IEEE VLSI Symp., p.134 (2006)
2. M. Tada, et al., IEEE IEDM, p.351 (2006)
3. J. Kawahara, et al., IEEE IEDM, p.143 (2003)
4. N. Ohashi, et al., IEEE IITC, p.144 (2007).
5. M. Tada, et al., J.Electrochem. Soc., 154(7) D354 (2007).