A microfluidic-electric package for power MEMS generators

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2008, Pages 112-115

  Herrault, Florian ^a   Ji, Chang Hyeon ^a   Kim, Seong Hyok ^a   Wu, Xiaosong ^a   Allen, Mark G ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL BEARINGS; COMPOSITE MICROMECHANICS; COPPER; COPPER PLATING; ELECTRIC WINDINGS; ELECTROMAGNETISM; ELECTROPLATING; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; NANOFLUIDICS; OPTICAL DESIGN; PERMANENT MAGNETS; REACTIVE ION ETCHING;

ELECTROPLATED COPPER; FULLY INTEGRATED; HIGH-SPEED BALL BEARING; INTERNATIONAL CONFERENCES; MEASUREMENT RESULTS; MICRO-ELECTRO MECHANICAL SYSTEMS; MICRO-FLUIDIC; MULTI-FUNCTIONAL; POWER MEMS;

ELECTRIC GENERATORS;

EID: 50149112856     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2008.4443605     Document Type: Conference Paper

References (6)

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