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Volumn , Issue , 2008, Pages 455-458
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Experimental study on the dielectric-deformation behavior of SIO 2 in a sandwich structure
a
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPOSITE MICROMECHANICS;
MECHANICAL ENGINEERING;
MECHANICS;
MECHATRONICS;
MEMS;
MICROELECTROMECHANICAL DEVICES;
REACTIVE ION ETCHING;
SILICON COMPOUNDS;
DEFORMATION BEHAVIORS;
EXPERIMENTAL STUDIES;
INTERNATIONAL CONFERENCES;
MICRO-ELECTRO MECHANICAL SYSTEMS;
DEFORMATION;
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EID: 50149084500
PISSN: 10846999
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/MEMSYS.2008.4443691 Document Type: Conference Paper |
Times cited : (6)
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References (7)
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