Flex on cap - solder paste bumping

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 1997, Pages 115-116

  Elenius, Peter ^a  

^a Flip Chip Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; FLIP CHIP DEVICES; METALLIZING; RELIABILITY; SOLDERING; SOLDERING ALLOYS;

DIRECT CHIP ATTACH; FLEX ON CAP; SOLDER BUMP; SOLDER PASTE BUMPING; UNDER BUMP METALLIZATION;

ELECTRONICS PACKAGING;

EID: 0030674223     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (2)