Microstructured in-plane thermoelectric generators with optimized heat path

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 133-136

  Kockmann, N ^a   Huesgen, T ^b   Woias, P ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b WALTER SCHOTTKY INSTITUT   (Germany)

Author keywords

DRIE process; Electro deposition; Heat flux; Thermocouple; Thermogenerator

Indexed keywords

ACTUATORS; ALUMINUM; COPPER PLATING; DIRECT ENERGY CONVERSION; ENERGY CONVERSION; METALS; MICROSYSTEMS; OPTICAL DESIGN; POLYSILICON; SENSORS; SILICON; STANDARDS; THERMAL EFFECTS; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY; THERMOMETERS; TRANSDUCERS;

CHIP SURFACES; CMOS FABRICATION TECHNOLOGY; DRIE PROCESS; ELECTRO DEPOSITION; GRID STRUCTURES; HEAT FLOW PATH; HEAT FLUX; HEAT PATHS; HIGH INTEGRATION DENSITY; IN-PLANE; INTERNATIONAL CONFERENCES; OUTPUT POWERS; POLY-SI; SOLID-STATE SENSORS; TEMPERATURE DIFFERENCES; TEST CHIPS; THERMOCOUPLE; THERMOGENERATOR;

THERMOCOUPLES;

EID: 50049126685     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300089     Document Type: Conference Paper

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