Fully dry 2D and 3D self-assembly with interlocking pin fasteners

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 2079-2082

  Park, Sangjun ^a   Böhringer, Karl F ^a  

^a University of Washington   (United States)

Author keywords

2D self assembly; 3D self assembly; Dry self assembly; Interlocking structure

Indexed keywords

ACTUATORS; BINDING ENERGY; BINDING SITES; BIOCHEMISTRY; CLADDING (COATING); CURING; DRYING; MICROSYSTEMS; NONMETALS; OPTICAL DESIGN; PASSIVATION; SENSORS; SILICON; SUBSTRATES; TRANSDUCERS;

2D SELF-ASSEMBLY; DEEP RIE; DRY SELF-ASSEMBLY; INTERLOCKING STRUCTURE; INTERLOCKING STRUCTURES; INTERNATIONAL CONFERENCES; NOVEL METHODS; PACKING DENSITIES; SELF- ASSEMBLIES; SELF-ASSEMBLY PROCESSES; SIDEWALL PASSIVATION; SOLID-STATE SENSORS; TEST RESULTS;

SELF ASSEMBLY;

EID: 50049109112     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300574     Document Type: Conference Paper

References (5)

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