Thickness characterization of ultra thin wafers on carrier

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 238-241

  Teixeira, R C ^a,b   De Munck, K ^a,b   Baert, K ^a   Swinnen, B ^a   Knuttel A ^c   De Moor, P ^a  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c Isis Sentronics   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CIVIL AVIATION; ELECTRONICS PACKAGING; INFRARED DEVICES; LIGHT; LIGHT SOURCES; LIGHTING; MECHANICAL STABILITY; SILICON; SILICON WAFERS; TECHNOLOGY; THICKNESS MEASUREMENT;

3-D INTEGRATION; CARRIER WAFERS; HIGH-DENSITY; NEAR-INFRARED LIGHT; PACKAGING TECHNOLOGIES; SPECTRAL COHERENCE; THICKNESS VARIATIONS; ULTRA-THIN WAFERS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50049095330     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469740     Document Type: Conference Paper

References (7)

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