Process integration of inkjet printing and electroless plating for LTCC substrates

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 202-205

  Lok, B K ^a   Liang, Y N ^a   Gian, P W ^a   Xuechuan, Shan ^a   Lu, Albert C W ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COBALT; COBALT COMPOUNDS; ELECTROLESS PLATING; ELECTRONICS PACKAGING; INK; INTEGRATION; METALS; PLATING; PRINTING; PRINTING MACHINERY; PRINTING PRESSES; SILVER; SUBSTRATES; TECHNOLOGY; THICK FILMS;

BULK METALS; COLLOIDAL SOLUTIONS; CONDUCTIVE LINES; CONVENTIONAL OVENS; INK-JET PRINTING; INK-JET PRINTS; INKJET PRINTING PROCESS; INTRINSIC PROPERTIES; LATEST DEVELOPMENT; LOW TEMPERATURE CO-FIRED CERAMICS; LTCC SUBSTRATES; MASK-LESS PATTERNING; PACKAGING TECHNOLOGIES; PROCESS INTEGRATION; SEED LAYERS; SILVER NANO PARTICLES; SURFACE STUDY;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50049092018     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469759     Document Type: Conference Paper

References (6)

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