Optimization of a thermoelectric cooler-heat sink combination for active processor cooling

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 848-857

  Hasan, Mohd Hafiz ^a   Toh, Kok Chuan ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; HEAT SINKS; HEAT STORAGE; REFRIGERATORS; TECHNOLOGY; THERMOELECTRIC EQUIPMENT; THERMOELECTRIC REFRIGERATION; THERMOELECTRICITY;

AIR COOLING; ENHANCED COOLING; JUNCTION TEMPERATURES; PACKAGING TECHNOLOGIES; SYSTEMATIC METHODOLOGY;

COOLING SYSTEMS;

EID: 50049090051     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469806     Document Type: Conference Paper

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