Novel Wafer Level package technology studies for image sensor devices

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 153-157

  Viswanadam, Gautham ^a   Bicck, Florian ^a   Suthiwongsumhor, Nathapong ^a  

^a SCHOTT Advanced Packaging Singapore Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; ELECTRIC LINES; IMAGE SENSORS; MICROPROCESSOR CHIPS; RELIABILITY THEORY; SILICON WAFERS;

IMAGE SENSOR DEVICES; JEDEC / JIS STANDARDS; WAFER LEVEL PACKAGES;

CHIP SCALE PACKAGES;

EID: 33847309664     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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8. Gautham Viswanadam, Invited speech on Wafer Level packaging for optical and imaging devices. Chip China 2005 Conference, September 2005, Shanghai, China.