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Volumn , Issue , 2007, Pages 293-296
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Direct fabrication of super -fine wiring and bumping by using inkjet process
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Author keywords
Micro wiring; Micro bumps; Super fine inkjet
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Indexed keywords
ADHESIVES;
DEWATERING;
DROP FORMATION;
DROPS;
ELECTRONICS INDUSTRY;
FLUID MECHANICS;
METAL DRAWING;
METALS;
MICROELECTRONICS;
OPTICAL DESIGN;
PHOTONICS;
POLYMERS;
TECHNOLOGY;
THREE DIMENSIONAL;
CONDUCTIVE PASTES;
CURRENT PACKAGING;
DIRECT FABRICATION;
FINE PATTERN PROCESSING;
INK-JET TECHNOLOGY;
METAL WIRES;
MICRO WIRING;
MICRO-BUMPS;
NANO-METAL PARTICLES;
ROOM TEMPERATURES;
SUPER-FINE INKJET;
THREE-DIMENSIONAL STRUCTURING;
LAW ENFORCEMENT;
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EID: 49949089387
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/POLYTR.2007.4339186 Document Type: Conference Paper |
Times cited : (11)
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References (6)
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