High aspect ratio micro tool manufacturing for polymer replication using μeDM of silicon, selective etching and electroforming

Microsystem Technologies

Volumn 14, Issue 9-11, 2008, Pages 1757-1764

  Tosello, G ^a   Bissacco, G ^a   Tang, P T ^b   Hansen, H N ^a   Nielsen, P C ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b IPU Denmark   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC DISCHARGE MACHINING; ELECTRIC DISCHARGES; ELECTROCHEMISTRY; ELECTROFORMING; ELECTROMETALLURGY; ETCHING; FORMING; INJECTION MOLDING; LITHOGRAPHY; MICROOPTICS; MOLDING; NONMETALS; OPTICAL DESIGN; PHOTORESISTS; POLYMERS; PRESSURE DROP; REUSABILITY; SILICON;

HIGH ASPECT RATIO; INJECTION MOULDING; INNOVATIVE PROCESSES; LOW COSTS; MASS FABRICATION; MICRO COMPONENTS; MICRO INJECTION; MICRO TOOLS; MICRO-ELECTRICAL DISCHARGE MACHINING; POLYMER REPLICATION; REPLICATION PROCESSES; SELECTIVE ETCHING; SILICON SUBSTRATES;

ASPECT RATIO;

EID: 49949085496     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0564-9     Document Type: Conference Paper

References (9)

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