Fabrication of micro components to Silicon wafer using EDM process

Materials Science Forum

Volumn 505-507, Issue PART 1, 2006, Pages 217-222

  Weng, Feng Tsai ^a   Hsu, Chen Siang ^a   Lin, Wen Feng ^a  

^a NATIONAL FORMOSA UNIVERSITY   (Taiwan)

Author keywords

Batch production; EDM; Graphite copper; Micro hole; Silicon wafer

Indexed keywords

COPPER; ELECTRIC DISCHARGE MACHINING; GRAPHITE; GRAPHITE ELECTRODES; TUNGSTEN CARBIDE;

BATCH PRODUCTION; EDM DRILLING; EDM MACHINING; MICRO HOLES;

SILICON WAFERS;

EID: 35348842114     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-990-3.217     Document Type: Conference Paper

References (5)

1. Dominiek Reynaerts., paul-Henhi's Heeren., Hendrik Van Brussel.," Microstructuring of silicon by electro-discharge machining(EMD)-part 1". Sensors and Actuators. A 60.(1997). Pp212-218.
2. Yoshiyuki. Uno Akira Okada., Kazuo. Yamazaki., Subhash.H. Risbud., Yoshiaki Yamada."High efficiency fine boring of monocrystalline silicon ingot by electrical discharge machining". Precisiom Engineering.23.(1999). pp126-133.
3. Masanori. Kunieda.,Satoyuki. Ojima., "Improvement of EDM efficiency of silicon single crystal through ohmic contact "Journal of the International Societies for Precision Engineering andNanotechnology.24(2000). Pp185-190.
4. T. Masuzawa, M. Fujino, k. Kobayasi, T. Suzuki, Wire electro-Discharge Grinding for micro machining, Ann. CIRP 34 (1) (1985) 431-434.
5. Feng-Tsai Weng and Ming-Guo Her., "Study on the Batch Production of Micro parts using EDM Process". The international journal of advanced manufacturing technology. No 973, Vol 19, No 4, pp 266-270. 2002.