Mechanical and thermal properties of AlN-BN-SiC ceramics

Materials Science and Engineering: A

Volumn 494, Issue 1-2, 2008, Pages 239-246

  Buchheit, Andrew A ^a   Hilmas, Greg E ^a   Fahrenholtz, William G ^a   Deason, Douglas M ^b   Wang, Hsin ^c  

^a University of Missouri Rolla   (United States)

^b U S ARMY SPACE AND MISSILE DEFENSE COMMAND   (United States)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

Aluminum nitride; Boron nitride; Hot pressing; Mechanical properties; Silicon carbide; Thermal properties

Indexed keywords

BORON NITRIDE; CERAMIC MATERIALS; FRACTURE TOUGHNESS; GRAIN SIZE AND SHAPE; HOT PRESSING; III-V SEMICONDUCTORS; NITRIDES; SILICON CARBIDE; THERMAL CONDUCTIVITY;

COMPOSITE CERAMIC; DIFFERENT PARTICLE SIZES; FRACTURE TOUGHNESS VALUES; GRAINSIZE; MATRIX; MECHANICAL AND THERMAL PROPERTIES; OTHER PROPERTIES; RELATIVE DENSITY; SIC CERAMICS; SMALL PARTICLES;

ALUMINUM NITRIDE;

EID: 49849101508     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2008.05.051     Document Type: Article

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