Investigation of filler effect on treeing phenomenon in epoxy resin under ac voltage

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 15, Issue 4, 2008, Pages 1112-1119

  Kurnianto, Rudi ^a   Murakami, Yoshinobu ^a   Nagao, Masayuki ^a   Hozumi, Naohiro ^b  

^a TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

^b AICHI INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Adhesion property; Epoxy resin; Filler; Moisture; Release agent; Silane coupling treatment; Treeing

Indexed keywords

CLARIFICATION; CRACK PROPAGATION; EPOXY RESINS; OXIDE MINERALS; PAINTING; QUARTZ; RESINS; SILANES; SILICA; SILICATE MINERALS; SILICON COMPOUNDS;

AC VOLTAGE; ADHESION PROPERTY; ENERGY DISPERSIONS; EPOXY RESIN; FILLER; INSULATION MATERIALS; MOISTURE; PROPAGATION RATE; QUARTZ PLATES; RELEASE AGENT; SILANE COUPLING; SILANE COUPLING TREATMENT; SILICA FILLERS; TREEING; TREEING PHENOMENA;

FILLERS;

EID: 49449107142     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2008.4591234     Document Type: Article

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