Effect of moisture on treeing phenomenon in epoxy resin with filer under ac voltage

Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report

Volumn , Issue , 2002, Pages 951-954

  Nagao, Masayuki ^a   Oda, K ^a   Nishioka, K ^a   Muramoto, Y ^a   Hozumi, N ^a  

^a TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; ELECTRIC INSULATING MATERIALS; ELECTRIC POTENTIAL; FILLERS; MECHANICAL PROPERTIES; MICROSTRUCTURE; MOISTURE; THERMODYNAMIC PROPERTIES;

ALTERNATING CURRENTS; TREEING PHENOMENON;

EPOXY RESINS;

EID: 0036438469     PISSN: 00849162     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. rdICPADM (91-CI-L2937-1), Vol.1, J-1, pp.592-597, Tokyo, Japan (1991).
2. M. Ezoe, S. Yamanaka, M. Tada & H. Kawamura: "The influence of Filler Shape and Water Absorption on Dielectric Properties", Trans. I.E.E. Japan, Vol.119-A, No.7, pp.1011-1108 (1999 - 7) (in Japanese)
3. K. Goto, H. Sekiya, A. Fukuda, S. Kinosita & T. Shimizu: "Dielectric Properties and Interface Treatment of Filler of Epoxy Resin ", The Papers of Joint Technical Meeting of ED & DEl, I.E.E. Japan, ED-00-40, DEI-00-44 (2000) (in Japanese)
4. T. Tokoro: "Degradation of Hydrophobicity of Polymer Insulating Materials by the Absorption of Saline Water and the Change of Surface Energy", The Papers of Technical Meeting of DEI, I.E.E. Japan, DEI-97-39 (1997) (in Japanese).
5. th ICPADM (97CH35794), Vol. 1, 01P07, pp.82-45, Seoul, Korea (1997).
6. M. Nagao, K. Oda, K. Nishioka, Y. Muramoto & N. Hozumi: "Effert of Filler in Treeing Phenomenon in Epoxy Resin under AC voltage", Proceedings of 2001 ISEIM (01TH8544), Q-1, pp.11-14, Himeji, Japan (2001).