Fabrication of 100 nm pitch copper interconnects by electron beam lithography

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 4, 2004, Pages

  Wu, W ^a,b   Jonckheere, R ^a   Tokel Z ^a   Brongersma, S H ^a   Van Hove, M ^a   Maex, K ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIELECTRIC FILMS; DRY ETCHING; ELECTRON BEAM LITHOGRAPHY; EXCIMER LASERS; FINITE ELEMENT METHOD; GLASS; PHOTORESISTS; PHYSICAL VAPOR DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA ETCHING; POLYMETHYL METHACRYLATES; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SPIN COATING;

COPPER INTERCONNECTS; DIELECTRIC LAYERS; SILICATE GLASS; UV LITHOGRAPHY;

INTERCONNECTION NETWORKS;

EID: 4944262884     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1771668     Document Type: Article

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