Studies on the fracture and flexural strength of Al/Sip composite

Materials Letters

Volumn 58, Issue 27-28, 2004, Pages 3545-3550

  Zhang, Qiguo ^a   Zhang, Hongxiang ^a   Gu, Mingyuan ^a   Jin, Yanping ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Al Sip; Al Sip+SiCp; Flexural strength; Microcracks; Vickcrs hardness

Indexed keywords

BENDING STRENGTH; ELASTIC MODULI; FRACTURE TESTING; MICROCRACKING; PARTICLE SIZE ANALYSIS; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; THERMAL CONDUCTIVITY; THERMAL EXPANSION; VICKERS HARDNESS TESTING;

ELECTRONIC PACKAGING MATERIALS; GAS INFILTRATION; PURE ALUMINUM; SILICON PARTICLES;

ALUMINUM;

EID: 4944238659     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2004.07.006     Document Type: Article

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