Effects of Sip size and volume fraction on properties of Al/Sip composites

Materials Letters

Volumn 52, Issue 4-5, 2002, Pages 334-341

  Chien, C W ^a   Lee, S L ^a   Lin, J C ^a   Jahn, M T ^b  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b CALIFORNIA STATE UNIVERSITY   (United States)

Author keywords

Coefficient of thermal expansion; Composites; Electronic packaging; Flexural strength; Squeeze infiltration; Thermal conductivity

Indexed keywords

BENDING STRENGTH; HIGH TEMPERATURE OPERATIONS; PARTICLE SIZE ANALYSIS; SILICON ALLOYS; SINTERING; THERMAL CONDUCTIVITY; THERMAL EXPANSION; VOLUME FRACTION;

SQEEZE INFILTRATION;

COMPOSITE MATERIALS;

EID: 0036466825     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(01)00418-9     Document Type: Article

References (14)