On the eruptive boiling in silicon-based microchannels

International Journal of Heat and Mass Transfer

Volumn 51, Issue 19-20, 2008, Pages 4841-4849

  Lee, P C ^a   Pan, Chin ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Eruptive nucleate boiling; Microchannel

Indexed keywords

ELECTRON BEAM LITHOGRAPHY; MACHINING; NONMETALS; SILICON; SILICON WAFERS; SURFACE ROUGHNESS; WAFER BONDING;

ANODIC BONDING; ATOMIC FORCE MICROSCOPE; BULK MICRO-MACHINING; ERUPTIVE NUCLEATE BOILING; HYDRAULIC DIAMETERS; MASS FLUXES; MICROCHANNEL; RECTANGULAR MICROCHANNEL; SIDE WALLS; SILICON-BASED; SOI WAFERS; ULTRA-HIGH; WIDTH RATIOS;

MICROCHANNELS;

BOILING; BUBBLES; HYDRAULICS; IMAGE ANALYSIS; INSULATION; LITHOGRAPHY; MACHINING; NONMETALS; NUCLEATION; SILICON; SURFACE PROPERTIES;

EID: 49349089938     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2008.02.033     Document Type: Article

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