Structural investigation of direct current magnetron sputtered Ti/NiV/Ag layers on n+Si substrate

Thin Solid Films

Volumn 516, Issue 21, 2008, Pages 7497-7504

  Resnik, D ^a   Kovac J ^b   Vrtacnik D ^a   Amon, S ^a  

^a UNIVERSITY OF LJUBLJANA   (Slovenia)

^b JO EF STEFAN INSTITUTE   (Slovenia)

Author keywords

Adhesion; Auger electron spectroscopy; Metallization; Ti NiV Ag; Ti Si interface; X ray photoelectron spectroscopy

Indexed keywords

THICK FILMS;

ADHESION; AUGER ELECTRON SPECTROSCOPY; DIRECT CURRENT; DIRECT-CURRENT MAGNETRON; METALLIZATION; STRUCTURAL INVESTIGATIONS; THIN FILM METALLIZATION; TI/NIV/AG; TI/SI INTERFACE; X-RAY PHOTOELECTRON SPECTROSCOPY;

VAPOR DEPOSITION;

EID: 49349087090     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.03.050     Document Type: Article

References (12)

1. Kondo I., Yoneyama T., Kondo K., and Takenaka O. J. Vac. Sci. Technol., A 10 (1992) 3166
2. Kondo I., Yoneyama T., Kondo K., Takenaka O., and Kinbara A. J. Vac. Sci. Technol., A 11 (1993) 319
3. Kondo I., Yoneyama T., Kondo K., Takenaka O., and Kinbara A. Thin Solid Films 236 (1993) 236
4. Yoneyama T., Kondo I., and Takenaka O. Thin Solid Films 193/194 (1990) 1056
5. Beyers R., and Sinclair R. J. Appl. Phys. 57 (1985) 5240
6. Ma E. Mater. Sci. Eng., A 398 (2005) 60
7. Gong S.F., and Hentzell H.T.G. J. Appl. Phys. 68 (1990) 4542
8. Gong S.F., Robertsson A., Hentzell H.T.G., and Li X.-H. J. Appl. Phys. 68 (1990) 4535
9. Pestana R., and Filho S.G.S. Rev. Brasiliera de Aplic. Vac. 24 (2005) 117
10. Chen L.J. Mater. Sci. Eng. R29 (2000) 115
11. Pantel R., Levy D., Nicolas D., and Ponpon J.P. J. Appl. Phys. 62 (1987) 4319
12. Vogt K.W., Kohl P.A., Carter W.B., Bell R.A., and Bottomley A. Surf. Sci. 301 (1994) 203