Bond strength of AH Plus and Epiphany sealers on root dentine irradiated with 980 nm diode laser

International Endodontic Journal

Volumn 41, Issue 9, 2008, Pages 733-740

  Alfredo, E ^b   Silva, S R C ^b   Ozorio J E V ^b   Sousa Neto, M D ^c   Brugnera Junior A ^b   Silva Sousa, Y T C ^a,b  

^a Jardim Canadá ^*  (Brazil)

^b UNIVERSITY OF RIBEIRÃO PRETO   (Brazil)

^c UNIVERSITY OF SÃO PAULO   (Brazil)

Author keywords

980 nm diode laser; Bond strength; Push out test; Root canal sealers

Indexed keywords

AH PLUS; DENTIN BONDING AGENT; EPIPHANY SEALER; EPOXY RESIN; ROOT CANAL FILLING MATERIAL;

ADHESION; ARTICLE; CANINE TOOTH; COMPARATIVE STUDY; DENTAL BONDING; DENTAL CARE; DENTAL SURGERY; DENTIN; DIODE LASER; ENDODONTICS; EVALUATION; HUMAN; RADIATION EXPOSURE;

ADHESIVENESS; CUSPID; DENTAL BONDING; DENTAL RESTORATION FAILURE; DENTAL STRESS ANALYSIS; DENTIN; DENTIN-BONDING AGENTS; EPOXY RESINS; HUMANS; LASERS, SEMICONDUCTOR; ROOT CANAL FILLING MATERIALS; ROOT CANAL PREPARATION;

EID: 49249123655     PISSN: 01432885     EISSN: 13652591     Source Type: Journal    
DOI: 10.1111/j.1365-2591.2008.01418.x     Document Type: Article

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