The fracture behavior of functionally graded piezoelectric materials with dielectric cracks

International Journal of Fracture

Volumn 149, Issue 1, 2008, Pages 87-104

  Jiang, L Y ^a  

^a UNIVERSITY OF WESTERN ONTARIO   (Canada)

Author keywords

Deformation dependent electric boundary condition; Dielectriccrack; Functionally graded materials (FGMs); Piezoelectric materials

Indexed keywords

BOUNDARY CONDITIONS; CHEBYSHEV APPROXIMATION; COMPUTER SIMULATION; CONTROL THEORY; CRITICAL CURRENT DENSITY (SUPERCONDUCTIVITY); DEFORMATION; DIELECTRIC MATERIALS; FOURIER TRANSFORMS; FRACTURE; FRACTURE FIXATION; FUNCTIONALLY GRADED MATERIALS; MEMS; MILITARY DATA PROCESSING; NONLINEAR EQUATIONS; PHOTOACOUSTIC EFFECT; PIEZOELECTRIC DEVICES; PIEZOELECTRIC MATERIALS; PIEZOELECTRICITY;

APPLIED (CO); BUSINESS MEDIA; CHEBYSHEV POLYNOMIALS; CRACK MODELING; CRACK OPENING DISPLACEMENT (COD); CRACK SURFACES; CRITICAL STATES; DEFORMATION MODES; DIELECTRIC CRACKS; DIELECTRIC MEDIUM; ELECTRIC BOUNDARY CONDITIONS; ELECTRO MECHANICAL LOADS; ELECTRO-MECHANICAL LOADING; FOURIER; FRACTURE BEHAVIORS; FUNCTIONALLY GRADED PIEZOELECTRIC MATERIALS (FGPM); LOWER BOUNDS; NUMERICAL SIMULATIONS; SINGULAR EQUATIONS; SOLUTION TECHNIQUES; SPRINGER (CO); TRANSITION (JEL CLASSIFICATIONS:E52 ,E41 ,E31);

CRACKS;

EID: 48949115129     PISSN: 03769429     EISSN: 15732673     Source Type: Journal    
DOI: 10.1007/s10704-008-9236-0     Document Type: Article

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