The role of creep in the time-dependent resistance of Ohmic gold contacts in radio frequency microelectromechanical system devices

Journal of Applied Physics

Volumn 104, Issue 2, 2008, Pages

  Rezvanian, O ^a   Brown, C ^b   Zikry, M A ^a   Kingon, A I ^a   Krim, J ^b   Irving, D L ^a   Brenner, D W ^a  

^a North Carolina State University   (United States)

^b NORTH CAROLINA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; CREEP; ELECTROMECHANICAL DEVICES; GOLD; LAWS AND LEGISLATION; MECHATRONICS; MEMS; MICROMECHANICS; OHMIC CONTACTS; PHOTORESISTS; RADIO WAVES; SURFACE ROUGHNESS; SWITCHES; TIME SWITCHES;

APPLIED STRESSES; CONTACT-RESISTANCE; CREEP MODELS; CREEP RATES; ELECTRICAL RESISTANCES; MATERIAL SELECTIONS; MEMS DEVICES; MICRO-ELECTRO MECHANICAL SYSTEMS; OHMIC GOLD; OHMIC SWITCHES; POWER LAW RELATIONS; POWER LAWS; PREFACTOR; RADIO FREQUENCIES; RATIONAL DESIGN; RF-MEMS; SINGLE ASPERITY; SWITCH OPERATION; TIME-DEPENDENT;

MICROELECTROMECHANICAL DEVICES;

EID: 48849094840     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2953072     Document Type: Article

References (9)

1. See, for example, G. M. Rebeiz, RF MEMS: Theory, Design and Technology (Wiley, Hoboken, 2003).
2. O. Rezvanian, M. Zikry, C. Brown, and J. Krim, J. Micromech. Microeng. 17, 2006 (2007).
3. C. Brown, A. S. Morris, A. I. Kingon, and J. Krim, " Cryogenic Performance of RF MEMS Switch Contacts.," J. Microelectromech. Syst. (in press).
4. H. A. Francis, Wear 45, 221 (1977).
5. M. O'Callaghan and M. A. Cameron, Wear 36, 79 (1976).
6. W. Yan and K. Komvopoulos, J. Appl. Phys. 84, 3617 (1998).
7. B. D. Jenson, L. L.-W. Chow, K. Huang, K. Saitou, J. L. Volarkis, and K. Kurabayashi, J. Microelectromech. Syst. 14, 935 (2005).
8. Electrical Contacts: Principles and Applications edited by, P. G. Slade, (Dekker, New York, 1999).
9. H. P. Koidl, W. F. Rieder, and Q. R. Saltzmann, IEEE Trans. Compon. Packag. Technol. 22, 439 (1999).