Thermal degradation and mass transport of underfill material

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 2, Issue , 2007, Pages 719-723

  Lee, Wen Hao ^a   Jiang, D S ^a   Wang, Y P ^a   Hsiao, C S ^a  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACIAL FAILURES; MICROHOLES; SOLDER REFLOW PROFILE; UNDERFILL MATERIALS;

BOND STRENGTH (MATERIALS); ELECTRONICS PACKAGING; FILLERS; MASS TRANSFER; PYROLYSIS; THERMOGRAVIMETRIC ANALYSIS;

FLIP CHIP DEVICES;

EID: 40449105956     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33057     Document Type: Conference Paper

References (9)