Small-sized dual-band SAW filters using flip-chip bonding technology

Proceedings of the IEEE Ultrasonics Symposium

Volumn 1, Issue , 1999, Pages 341-346

  Koshino, M ^a   Kawase, M ^a   Kuroda, Y ^a   Mishima, N ^a   Takagi, T ^a   Sakinada, K ^a   Ebata, Y ^a   Kimura, S ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CELLULAR TELEPHONE SYSTEMS; DIGITAL COMMUNICATION SYSTEMS; ELECTRONICS PACKAGING; EQUIPMENT TESTING; FLIP CHIP DEVICES; MULTILAYERS; RELIABILITY; SURFACE MOUNT TECHNOLOGY; TELEPHONE SETS; THERMAL EFFECTS; ULTRASONIC TRANSDUCERS;

DIGITAL CELLULAR SYSTEM; DUAL BAND FILTERS; EXTENDED GLOBAL SYSTEM FOR MOBILE COMMUNICATION; FLIP CHIP BONDING TECHNOLOGY; INTERDIGITATED INTERDIGITAL TRANSDUCER;

ACOUSTIC SURFACE WAVE FILTERS;

EID: 0033293799     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ultsym.1999.849415     Document Type: Conference Paper

References (4)